MUBW25-06A6K
Ouput Inverter T1 - T6
Ratings
Symbol
V CES
V GES
V GEM
I C25
I C80
P tot
Definitions
collector emitter voltage
max. DC gate voltage
max. transient collector gate voltage
collector current
total power dissipation
Conditions
continuous
transient
T VJ = 25°C to  50°C
T C = 25°C
T C = 80°C
T C = 25°C
min.
typ.
max.
600
±20
±30
 00
Unit
V
V
V
A
A
W
V CE(sat)
V GE(th)
I CES
collector emitter saturation voltage
gate emitter threshold voltage
collector emitter leakage current
I C = 20 A; V GE =  5 V
I C = 0.5 mA; V GE = V CE
V CE = V CES ; V GE = 0 V
T VJ = 25°C
T VJ =  25°C
T VJ = 25°C
T VJ = 25°C
T VJ =  25°C
4.5
2. 
2.3
 .3
2.4
6.5
0.6
V
V
V
mA
mA
I GES
C ies
Q G(on)
gate emitter leakage current
input capacitance
total gate charge
V CE = 0 V; V GE = ±20 V
V CE = 25 V; V GE = 0 V; f =   MHz
V CE = 300 V; V GE =  5 V; I C = 20 A
  00
65
 00
nA
pF
nC
t d(on)
t r
t d(off)
t f
E on
E off
turn-on delay time
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
inductive load
V CE = 300 V; I C = 20 A
V GE = ± 5 V; R G = 47 W
T VJ =  25°C
50
60
300
30
0.95
0.7
ns
ns
ns
ns
mJ
mJ
I CM
reverse bias safe operating area
RBSOA; V GE = ± 5 V; R G = 47 W
L =  00 μH; clamped induct. load T VJ =  25°C
V CEmax = V CES - L S · di/dt
40
A
t SC
(SCSOA)
R thJC
R thCH
short circuit safe operating area
thermal resistance junction to case
thermal resistance case to heatsink
V CE = 600 V; V GE = ± 5 V;
R G = 47 W ; non-repetitive
(per IGBT)
(per IGBT)
T VJ =  25°C
 0
0.45
 .25
μs
K/W
K/W
Output Inverter D1 - D6
Ratings
Symbol
V RRM
I F25
I F80
V F
I RM
t rr
E rec(off)
Definitions
max. repetitve reverse voltage
forward current
forward voltage
max. reverse recovery current
reverse recovery time
reverse recovery energy
Conditions
I F = 20 A; V GE = 0 V
V R = 300 V
di F /dt = -400 A/μs
I F = 20 A; V GE = 0 V
T VJ =  50°C
T C = 25°C
T C = 80°C
T VJ = 25°C
T VJ =  25°C
T VJ =  00°C
min.
typ.
 .6
 4
90
tbd
max.
600
36
24
2.2
Unit
V
A
A
V
V
A
ns
μJ
R thJC
R thCH
thermal resistance junction to case
thermal resistance case to heatsink
(per diode)
(per diode)
0.55
 .6
K/W
K/W
T C = 25°C unless otherwise stated
IXYS reserves the right to change limits, test conditions and dimensions.
? 2007 IXYS All rights reserved
2007   3a
2-5
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MUBW25-06A6 MODULE IGBT CBI E1
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